EP3CLS200F484C8N vs EP3CLS200F484C8 Comparison
Detailed side-by-side comparison of EP3CLS200F484C8N by Intel and EP3CLS200F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS200F484C8N | EP3CLS200F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,245.00 | $118.00 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cycloneยฎ III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 198,464 | โ |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits (approx 8 Mbit) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | โ |
| Embedded Multipliers (18x18) | 396 | โ |
| User I/O Pins | 210 | โ |
| Number of PLLs | 4 | โ |
| Global Clock Networks | 20 | โ |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | โ |
| Package | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-pin FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | โ |
| Temperature Grade | Commercial (0C to +85C TJ) | โ |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | โ |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | โ |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | โ | 198,464 |
| Logic Array Blocks (LAB) | โ | 20,5056 (approx) |
| Embedded 18x18 Multipliers | โ | 210 |
| PLLs | โ | 4 |
| Maximum User I/O | โ | 304 |
| I/O Banks | โ | 8 |
| Package Dimensions | โ | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | โ | AS, PS, FPP, JTAG |
| Security | โ | Design encryption / bitstream AES |
| Operating Temperature | โ | 0C to +85C (commercial, 'C' suffix) |