EP3CLS200F484C8N vs EP3CLS200F484C8 비교
다음의 상세 나란히 비교: EP3CLS200F484C8N 제조: Intel 및 EP3CLS200F484C8 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3CLS200F484C8N | EP3CLS200F484C8 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,245.00 | $118.00 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone® III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits (approx 8 Mbit) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | — |
| 패키지 | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-pin FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | — |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| RoHS 상태 | Compliant | Compliant |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded 18x18 Multipliers | — | 210 |
| PLLs | — | 4 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| 동작 온도 | — | 0C to +85C (commercial, 'C' suffix) |