EP3CLS200F780I7N vs EP3CLS200F780C8ES Vergleich
Detaillierter Direktvergleich von EP3CLS200F780I7N von Intel und EP3CLS200F780C8ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780I7N | EP3CLS200F780C8ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $240,00 | $215,00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,404 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | 8 |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | — |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Gehäuse | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free per FBGA-780 datasheet note) | Compliant (lead-free FBGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded 18x18 Multipliers | — | 396 |
| Core Supply Voltage | — | 1.2 V |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |