EP3CLS200F780I7N vs EP3CLS200F780C8ES Comparação
Comparação detalhada lado a lado de EP3CLS200F780I7N por Intel e EP3CLS200F780C8ES por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3CLS200F780I7N | EP3CLS200F780C8ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $240,00 | $215,00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,404 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | 8 |
| Temperatura de operação | -40 °C to +100 °C (industrial) | — |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Encapsulamento | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free per FBGA-780 datasheet note) | Compliant (lead-free FBGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded 18x18 Multipliers | — | 396 |
| Core Supply Voltage | — | 1.2 V |
| Temperatura de junção de operação | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |