EP3SE260F1152C2 vs EP3SE260F1152C3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152C2 von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE260F1152C2 | EP3SE260F1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.400,00 | $7.500,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 744 | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Gehäuse | 1152-ball FC-FBGA (Flip Chip) | 1152-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | C2 (commercial) | — |
| Betriebstemperatur | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] | 0 C to +85 C (Commercial) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Design Software | Quartus II (Stratix III support) | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |