EP3SE260F1152C2 vs EP3SE260F1152C3N Сравнение
Подробное сравнение бок о бок EP3SE260F1152C2 от Intel и EP3SE260F1152C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ АктивенСравнение характеристик
| Параметр | EP3SE260F1152C2 | EP3SE260F1152C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $2.400,00 | $7.500,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 744 | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Корпус | 1152-ball FC-FBGA (Flip Chip) | 1152-BBGA, FCBGA |
| Тип монтажа | Surface Mount | Surface Mount |
| Speed Grade | C2 (commercial) | — |
| Рабочая температура | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] | 0 C to +85 C (Commercial) |
| Статус RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Design Software | Quartus II (Stratix III support) | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |