EP3SE260F1152C2 vs EP3SE260F1152C3N Comparison

Detailed side-by-side comparison of EP3SE260F1152C2 by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2 EP3SE260F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $2,400.00 $7,500.00
Manufacturer Intel (formerly Altera) โ€”
Series Stratixยฎ III E Stratix III E
Logic Elements (LE) 255,000 โ€”
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory (bits) 16,672,768 โ€”
User I/Os 744 โ€”
User I/O Banks [DATA_NEEDED: I/O bank count] โ€”
Core Voltage (VCCINT) 1.1 V โ€”
Process Technology 65 nm CMOS 65 nm
Package 1152-ball FC-FBGA (Flip Chip) 1152-BBGA, FCBGA
Mounting Type Surface Mount Surface Mount
Speed Grade C2 (commercial) โ€”
Operating Temperature Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits] 0 C to +85 C (Commercial)
RoHS Status Compliant Compliant
Lead-Free Yes โ€”
MSL Level [DATA_NEEDED: MSL rating] โ€”
Design Software Quartus II (Stratix III support) โ€”
Logic Elements / Cells โ€” 255,000
Embedded Memory Bits โ€” 16,672,768 bits
User I/O Count โ€” 744
Core Voltage โ€” 1.1 V
Transceivers โ€” Integrated high-speed transceivers
DSP Blocks โ€” Yes (dedicated multiplier/accumulator)
Embedded Memory Type โ€” TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support โ€” DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes โ€” AS, AP, PS, FPP, JTAG
Partial Reconfiguration โ€” Supported
Programmable Power Technology โ€” Yes (up to 50% dynamic power reduction)

Datasheets & Resources

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