EP3SE260F1517I4N vs EP3SE260F1517C3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I4N von Intel und EP3SE260F1517C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Letzte BestellmöglichkeitIntel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517I4N | EP3SE260F1517C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.500,00 | $9.850,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power CMOS |
| Gehäuse | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Betriebstemperatur | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL-Level | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| Betriebs-Sperrschichttemperatur | — | 0 C to +85 C (commercial) |
| RoHS-Status | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |