EP3SE260F1517I4N vs EP3SE260F1517C3N Comparación
Comparación detallada lado a lado de EP3SE260F1517I4N por Intel y EP3SE260F1517C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP3SE260F1517I4N | EP3SE260F1517C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.500,00 | $9.850,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power CMOS |
| Encapsulado | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Nivel MSL | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| Temperatura de unión de funcionamiento | — | 0 C to +85 C (commercial) |
| Estado RoHS | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |