EP3SE260F1517I4N vs EP3SE260F1517C3N Comparaison
Comparaison détaillée côte à côte de EP3SE260F1517I4N par Intel et EP3SE260F1517C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Dernier achat
Comparaison des spécifications
| Paramètre | EP3SE260F1517I4N | EP3SE260F1517C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10 500,00 | $9 850,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power CMOS |
| Boîtier | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Niveau MSL | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| Température de jonction en fonctionnement | — | 0 C to +85 C (commercial) |
| Statut RoHS | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |