EP3SE260H780C3 vs EP3SE260H780C4L Vergleich
Detaillierter Direktvergleich von EP3SE260H780C3 von Intel und EP3SE260H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260H780C3 | EP3SE260H780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.180,00 | $1.190,00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | C4 (middle/slow tier) |
| Betriebstemperatur | Commercial, 0C to +85C | — |
| Maximum Core Frequency | 500 MHz | — |
| Gehäuse | 780-ball FCBGA (HBGA), flip-chip | 780-ball FCBGA (HBGA 33x33 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS-Status | Compliant (per product listings) | Compliant (lead-free per datasheet) |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| Betriebs-Sperrschichttemperatur | — | 0C to +85C (commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |