EP3SE260H780C3 vs EP3SE260H780C4L 对比
详细并排对比 EP3SE260H780C3 出自 Intel 和 EP3SE260H780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780C3 | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,180.00 | $1,190.00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | C4 (middle/slow tier) |
| 工作温度 | Commercial, 0C to +85C | — |
| Maximum Core Frequency | 500 MHz | — |
| 封装 | 780-ball FCBGA (HBGA), flip-chip | 780-ball FCBGA (HBGA 33x33 mm) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| 湿敏等级（MSL） | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS 状态 | Compliant (per product listings) | Compliant (lead-free per datasheet) |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| 工作结温 | — | 0C to +85C (commercial) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |