EP3SE260H780C3 vs EP3SE260H780C4L 比較
詳細な並列比較: EP3SE260H780C3 メーカー: Intel および EP3SE260H780C4L メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3SE260H780C3 | EP3SE260H780C4L |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | NRND |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,180.00 | $1,190.00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | C4 (middle/slow tier) |
| 動作温度 | Commercial, 0C to +85C | — |
| Maximum Core Frequency | 500 MHz | — |
| パッケージ | 780-ball FCBGA (HBGA), flip-chip | 780-ball FCBGA (HBGA 33x33 mm) |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| 湿気感度レベル（MSL） | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS ステータス | Compliant (per product listings) | Compliant (lead-free per datasheet) |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| 動作接合温度 | — | 0C to +85C (commercial) |
| MSLレベル | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |