EP3SE260H780C4 vs EP3SE260H780C2N Vergleich
Detaillierter Direktvergleich von EP3SE260H780C4 von Intel und EP3SE260H780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
EP3SE260H780C4 ObsoleteIntel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780C4 | EP3SE260H780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.150,00 | $3.600,00 |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | — |
| Embedded Multipliers (18x18) | 576 | — |
| Distributed Memory | 1,020 Kbits | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Auxiliary Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Speed Grade | C4 | C2 |
| Gehäuse | 780-ball FCBGA (H780) | 780-BGA FCBGA |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status] |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Betriebstemperaturbereich | — | Commercial (0C to +85C) |
| MSL-Level | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |