EP3SE260H780C4L vs EP3SE260H780C3N Vergleich

Detaillierter Direktvergleich von EP3SE260H780C4L von Intel und EP3SE260H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260H780C4L EP3SE260H780C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.190,00 $1.325,00
Family Stratix III E —
Logic Elements 255,000 —
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) —
User I/O Count 488 —
Gehäuse 780-ball FCBGA (HBGA 33x33 mm) 780-BBGA, FCBGA (H780)
Speed Grade C4 (middle/slow tier) —
Core Voltage 0.9 V (nominal) —
Betriebs-Sperrschichttemperatur 0C to +85C (commercial) —
Montageart Surface Mount (flip-chip BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL level] —
RoHS-Status Compliant (lead-free per datasheet) Compliant (lead-free 'N' suffix)
Transceivers Up to 24 multi-gigabit transceivers [DATA_NEEDED: number of embedded transceivers and max data rate]
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
User I/Os — 488
Number of Pins / Balls — 780
Betriebstemperatur — 0 °C to +85 °C (C grade, commercial)
Process Technology — 40 nm CMOS
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Feuchtigkeitsempfindlichkeitsgrad (MSL) — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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