EP3SE260H780I3 vs EP3SE260H780I4L Vergleich
Detaillierter Direktvergleich von EP3SE260H780I3 von Intel und EP3SE260H780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I3 | EP3SE260H780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.410,00 | $1.395,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 | 16,672,640 |
| Embedded 18x18 Multipliers | 384 | — |
| User I/Os | 488 | — |
| Operating Frequency (logic) | 500 MHz | — |
| Operating Frequency (internal max) | 800 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Gehäuse | 780-Ball FC-HFBGA / FCBGA | — |
| Montageart | Surface Mount | Surface Mount (flip-chip) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| RoHS-Status | Lead Free / Compliant | Compliant (lead-free) |
| Betriebstemperatur | -40C to +100C (Industrial) | Industrial, -40C to +85C |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |