EP3SE50F780C2N vs EP3SE260H780C2N Vergleich
Detaillierter Direktvergleich von EP3SE50F780C2N von Intel und EP3SE260H780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE50F780C2N | EP3SE260H780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $278,90 | $3.600,00 |
| Family | Stratix III Enhanced (E) | — |
| Logic Elements | 47,500 | 255,000 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V to 1.1 V | 0.9 V |
| Maximum Internal Clock Frequency | 600 MHz | — |
| Gehäuse | 780-ball FC-FBGA (FBGA-780) | 780-BGA FCBGA |
| Speed Grade | C2 | C2 |
| Temperature Grade | Commercial (C2) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Betriebstemperaturbereich | — | Commercial (0C to +85C) |
| MSL-Level | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| RoHS-Status | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |