EP3SE50F780C2N vs EP3SE260H780C2N 对比
详细并排对比 EP3SE50F780C2N 出自 Intel 和 EP3SE260H780C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780C2N | EP3SE260H780C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $278.90 | $3,600.00 |
| Family | Stratix III Enhanced (E) | — |
| Logic Elements | 47,500 | 255,000 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V to 1.1 V | 0.9 V |
| Maximum Internal Clock Frequency | 600 MHz | — |
| 封装 | 780-ball FC-FBGA (FBGA-780) | 780-BGA FCBGA |
| Speed Grade | C2 | C2 |
| Temperature Grade | Commercial (C2) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| 工作温度范围 | — | Commercial (0C to +85C) |
| MSL 等级 | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| RoHS 状态 | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |