EP3SE50F780C2N vs EP3SE260H780C2N Comparaison
Comparaison détaillée côte à côte de EP3SE50F780C2N par Intel et EP3SE260H780C2N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE50F780C2N | EP3SE260H780C2N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $278,90 | $3 600,00 |
| Family | Stratix III Enhanced (E) | — |
| Logic Elements | 47,500 | 255,000 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V to 1.1 V | 0.9 V |
| Maximum Internal Clock Frequency | 600 MHz | — |
| Boîtier | 780-ball FC-FBGA (FBGA-780) | 780-BGA FCBGA |
| Speed Grade | C2 | C2 |
| Temperature Grade | Commercial (C2) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Plage de température de fonctionnement | — | Commercial (0C to +85C) |
| Niveau MSL | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| Statut RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |