EP3SL200F1517I4LN vs EP3SL200F1517I3N Vergleich

Detaillierter Direktvergleich von EP3SL200F1517I4LN von Intel und EP3SL200F1517I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200F1517I4LN EP3SL200F1517I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $6.300,00 $1.620,00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 —
Logic Array Blocks (LABs) 8,000 —
User I/O Pins 976 —
Gehäuse 1517-BBGA, FCBGA 1517-BBGA, FCBGA (FC-FBGA)
Process Technology 65 nm TSMC low-power 65 nm
Betriebstemperatur -40C to +100C (Industrial) -40C to +100C (Industrial)
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceiver Data Rate (max) [DATA_NEEDED: max transceiver rate] —
DSP Blocks (18x18 multipliers) 384 —
DSP Performance 288 GMACS —
Configuration Method Passive Parallel / Active Serial / JTAG —
Ball Pitch 1.0 mm —
Package Dimensions 40 mm x 40 mm —
Number of LABs — 8000
Total Memory Bits — 10,901,504
User I/Os — 976
Number of Logic Cells — 200000
Core Voltage — 1.1 V
Maximum Internal Frequency — 500 MHz
Number of Transceivers — [DATA_NEEDED: number of transceivers]
Supplier Device Package — 1517-FBGA
Configuration Memory — SRAM-based
Number of 18x18 Multipliers — 384

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