EP3SL200F1517I4LN vs EP3SL200F1517I3N 对比

详细并排对比 EP3SL200F1517I4LN 出自 Intel 和 EP3SL200F1517I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL200F1517I4LN EP3SL200F1517I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $6,300.00 $1,620.00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 —
Logic Array Blocks (LABs) 8,000 —
User I/O Pins 976 —
封装 1517-BBGA, FCBGA 1517-BBGA, FCBGA (FC-FBGA)
Process Technology 65 nm TSMC low-power 65 nm
工作温度 -40C to +100C (Industrial) -40C to +100C (Industrial)
安装类型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 状态 Compliant Compliant
Lead-Free Yes —
MSL 等级 [DATA_NEEDED: MSL moisture sensitivity level] —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceiver Data Rate (max) [DATA_NEEDED: max transceiver rate] —
DSP Blocks (18x18 multipliers) 384 —
DSP Performance 288 GMACS —
Configuration Method Passive Parallel / Active Serial / JTAG —
Ball Pitch 1.0 mm —
Package Dimensions 40 mm x 40 mm —
Number of LABs — 8000
Total Memory Bits — 10,901,504
User I/Os — 976
Number of Logic Cells — 200000
Core Voltage — 1.1 V
Maximum Internal Frequency — 500 MHz
Number of Transceivers — [DATA_NEEDED: number of transceivers]
Supplier Device Package — 1517-FBGA
Configuration Memory — SRAM-based
Number of 18x18 Multipliers — 384

数据手册与资源

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