EP3SL200H780I3N vs EP3SL200H780C3N Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3N von Intel und EP3SL200H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3N | EP3SL200H780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.200,00 | $4.995,00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| RAM Bits | 10,901,504 | — |
| User I/O | 488 | — |
| Gehäuse | 780-BBGA, FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Pin Count | 780 | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Supply Voltage (Core) | 0.9 V | — |
| Technology | CMOS, 40 nm | — |
| Process Node | 40 nm | 40 nm |
| Number of Terminals | 780 | — |
| Case / Package Code | BGA-780 | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| MSL-Level | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |