EP3SL200H780I3N vs EP3SL200H780C3N Comparación
Comparación detallada lado a lado de EP3SL200H780I3N por Intel y EP3SL200H780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3N | EP3SL200H780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.200,00 | $4.995,00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| RAM Bits | 10,901,504 | — |
| User I/O | 488 | — |
| Encapsulado | 780-BBGA, FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Pin Count | 780 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Supply Voltage (Core) | 0.9 V | — |
| Technology | CMOS, 40 nm | — |
| Process Node | 40 nm | 40 nm |
| Number of Terminals | 780 | — |
| Case / Package Code | BGA-780 | — |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Nivel MSL | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |