EP4CE75F23I7N vs EP4CE75F29I7 Vergleich
Detaillierter Direktvergleich von EP4CE75F23I7N von Intel und EP4CE75F29I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F23I7N | EP4CE75F29I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,00 | $121,30 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | — |
| Logic Elements (LEs) | 75,408 | 75,408 |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | — |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.0 V / 1.2 V selectable |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Gehäuse | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 780-ball FBGA (FineLine BGA) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | JTAG, Active Serial (AS), Passive Serial (PS) |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | DDR/DDR2 SDRAM, QDRII SRAM |
| Design Software | Quartus II / Quartus Prime | — |
| RoHS-Status | Compliant | Compliant |
| Series | — | Cyclone IV E |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 2,810,880 |
| Embedded Memory Blocks | — | 274 (M9K) |
| Embedded 18×18 Multipliers | — | 200 |
| User I/O Count | — | 426 |
| Betriebstemperatur | — | -40 °C to +100 °C (Industrial) |
| Process Node | — | 60 nm low-power CMOS |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| MSL-Level | — | 3 (168 hours) |
| Montageart | — | Surface Mount (BGA) |