EP4CE75F23I7N vs EP4CE75F29I7 Comparación
Comparación detallada lado a lado de EP4CE75F23I7N por Intel y EP4CE75F29I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F23I7N | EP4CE75F29I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $121,30 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | — |
| Logic Elements (LEs) | 75,408 | 75,408 |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | — |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.0 V / 1.2 V selectable |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Encapsulado | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 780-ball FBGA (FineLine BGA) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | JTAG, Active Serial (AS), Passive Serial (PS) |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | DDR/DDR2 SDRAM, QDRII SRAM |
| Design Software | Quartus II / Quartus Prime | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone IV E |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 2,810,880 |
| Embedded Memory Blocks | — | 274 (M9K) |
| Embedded 18×18 Multipliers | — | 200 |
| User I/O Count | — | 426 |
| Temperatura de funcionamiento | — | -40 °C to +100 °C (Industrial) |
| Process Node | — | 60 nm low-power CMOS |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Nivel MSL | — | 3 (168 hours) |
| Tipo de montaje | — | Surface Mount (BGA) |