EP4CE75F23I7N vs EP4CE75F29I7 Comparison

Detailed side-by-side comparison of EP4CE75F23I7N by Intel and EP4CE75F29I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE75F23I7N EP4CE75F29I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $118.00 $121.30
Product Line Cyclone IV E β€”
Family Cyclone IV E (EP4CE) β€”
Logic Elements (LEs) 75,408 75,408
Logic Array Blocks (LABs) 4,713 β€”
Embedded Memory Bits 2,810,880 bits (312 M9K blocks) β€”
Distributed RAM Bits 200 Kbits β€”
Embedded 18x18 Multipliers 15 β€”
PLLs 4 4
Global Clocks [DATA_NEEDED: global clock network count] β€”
Maximum User I/Os 292 β€”
Core Voltage (VCCINT) 1.2 V nominal 1.0 V / 1.2 V selectable
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) β€”
Process Technology 60 nm low-power CMOS β€”
Package 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Operating Temperature Grade Industrial (I7: -40C to +100C Tj) β€”
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG JTAG, Active Serial (AS), Passive Serial (PS)
External Memory Interfaces DDR / DDR2 SDRAM, QDRII SRAM DDR/DDR2 SDRAM, QDRII SRAM
Design Software Quartus II / Quartus Prime β€”
RoHS Status Compliant Compliant
Series β€” Cyclone IV E
Manufacturer β€” Intel (formerly Altera)
Embedded Memory (bits) β€” 2,810,880
Embedded Memory Blocks β€” 274 (M9K)
Embedded 18Γ—18 Multipliers β€” 200
User I/O Count β€” 426
Operating Temperature β€” -40 Β°C to +100 Β°C (Industrial)
Process Node β€” 60 nm low-power CMOS
I/O Standards Supported β€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
MSL Level β€” 3 (168 hours)
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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