EP4CGX50CF23I7NAA vs EP4CGX50CF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23I7NAA von Intel und EP4CGX50CF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23I7NAA | EP4CGX50CF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $79,50 | $110,50 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | — |
| Embedded Memory (Bits) | 2,562,048 | 2,562,048 (2.5 Mb) |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Betriebstemperaturbereich | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | C7 (commercial) |
| Gehäuse | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-FBGA (F23, 23 x 23 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Logic Elements (LE) | — | 49,888 |
| User I/O | — | 290 |
| Logic Array Blocks | — | 47 |
| Multi-Gigabit Transceivers | — | 4 channels up to 3.125 Gbps |
| Hard Memory Controllers | — | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) |
| I/O Voltage Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) |
| Betriebstemperatur | — | -40C to +85C (commercial) |
| Process Technology | — | 60 nm TSMC low-power |
| Configuration Modes | — | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel |