EP4CGX50CF23I7NAA vs EP4CGX50CF23C7N Comparison

Detailed side-by-side comparison of EP4CGX50CF23I7NAA by Intel and EP4CGX50CF23C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX50CF23I7NAA EP4CGX50CF23C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $79.50 $110.50
Family Cyclone IV GX Cyclone IV GX
Logic Elements (LEs) 49,888 β€”
Logic Array Blocks (LABs) 3,136 β€”
Embedded Memory (Bits) 2,562,048 2,562,048 (2.5 Mb)
Embedded Memory (M9K Blocks) 270 β€”
Embedded 18x18 Multipliers 132 β€”
Phase-Locked Loops (PLLs) 4 β€”
Global Clock Networks 20 β€”
Maximum User I/O Pins [DATA_NEEDED: exact max user I/O for F484] β€”
Transceivers 8 channels, up to 3.125 Gbps β€”
Core Voltage 1.2 V 1.2 V
Operating Temperature Range -40C to +100C (Industrial, I7) β€”
Speed Grade 7 C7 (commercial)
Package 484-ball FineLine BGA (F23), 1.0mm pitch 484-FBGA (F23, 23 x 23 mm)
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Scheme AS, PS, JTAG, FPP β€”
RoHS Status Compliant Compliant (lead-free)
Lead-Free Yes β€”
MSL Level 3 β€”
Logic Elements (LE) β€” 49,888
User I/O β€” 290
Logic Array Blocks β€” 47
Multi-Gigabit Transceivers β€” 4 channels up to 3.125 Gbps
Hard Memory Controllers β€” Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II)
I/O Voltage Standards β€” LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V)
Operating Temperature β€” -40C to +85C (commercial)
Process Technology β€” 60 nm TSMC low-power
Configuration Modes β€” JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel

Datasheets & Resources

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