EP4SGX70DF29I3G vs EP4SGX70HF35C3G Vergleich

Detaillierter Direktvergleich von EP4SGX70DF29I3G von Intel und EP4SGX70HF35C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX70DF29I3G EP4SGX70HF35C3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.080,00 $1.380,00
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 —
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V 0.87 V to 0.93 V
Speed Grade -3 HF35
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS-Status Compliant Compliant
Halogenfrei [DATA_NEEDED: halogen-free claim] —
Logic Elements — 72,600
LABs/CLBs — 2,904
Total RAM Bits — 7,564,880
User I/O Count — 488
Number of Transceivers — 8
Transceiver Data Rate (max) — 3.125 Gbps
Gehäuse — 1152-BBGA, FCBGA (35 mm × 35 mm)
Operating Temperature (Junction) — 0°C to 85°C
Temperature Grade — Commercial (C3)
Configuration Method — Passive Serial, Fast Passive Parallel, Active Serial, JTAG

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