EP4SGX70DF29I3G vs EP4SGX70HF35C3G 对比

详细并排对比 EP4SGX70DF29I3G 出自 Intel 和 EP4SGX70HF35C3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ 量产中

规格对比

参数 EP4SGX70DF29I3G EP4SGX70HF35C3G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,080.00 $1,380.00
Series Stratix IV GX Stratix IV GX
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 —
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V 0.87 V to 0.93 V
Speed Grade -3 HF35
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS 状态 Compliant Compliant
无卤 [DATA_NEEDED: halogen-free claim] —
Logic Elements — 72,600
LABs/CLBs — 2,904
Total RAM Bits — 7,564,880
User I/O Count — 488
Number of Transceivers — 8
Transceiver Data Rate (max) — 3.125 Gbps
封装 — 1152-BBGA, FCBGA (35 mm × 35 mm)
Operating Temperature (Junction) — 0°C to 85°C
Temperature Grade — Commercial (C3)
Configuration Method — Passive Serial, Fast Passive Parallel, Active Serial, JTAG

数据手册与资源

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