EP4SGX70HF35C3G vs EP4SGX70DF29I3G Vergleich
Detaillierter Direktvergleich von EP4SGX70HF35C3G von Intel und EP4SGX70DF29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX70HF35C3G | EP4SGX70DF29I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.380,00 | $1.080,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 | — |
| LABs/CLBs | 2,904 | — |
| Total RAM Bits | 7,564,880 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| Gehäuse | 1152-BBGA, FCBGA (35 mm × 35 mm) | — |
| Process Technology | 40 nm | 40 nm |
| Core Supply Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | 0°C to 85°C | — |
| Temperature Grade | Commercial (C3) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Speed Grade | HF35 | -3 |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Package Type | — | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | — | DF29 |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Halogenfrei | — | [DATA_NEEDED: halogen-free claim] |