EP4SGX70HF35C3G vs EP4SGX70DF29I3G 对比

详细并排对比 EP4SGX70HF35C3G 出自 Intel 和 EP4SGX70DF29I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ 量产中

规格对比

参数 EP4SGX70HF35C3G EP4SGX70DF29I3G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1,380.00 $1,080.00
Series Stratix IV GX Stratix IV GX
Logic Elements 72,600 —
LABs/CLBs 2,904 —
Total RAM Bits 7,564,880 —
User I/O Count 488 —
Number of Transceivers 8 —
Transceiver Data Rate (max) 3.125 Gbps —
封装 1152-BBGA, FCBGA (35 mm × 35 mm) —
Process Technology 40 nm 40 nm
Core Supply Voltage 0.87 V to 0.93 V 0.87 V to 0.93 V
Operating Temperature (Junction) 0°C to 85°C —
Temperature Grade Commercial (C3) —
安装类型 Surface Mount Surface Mount (BGA)
Speed Grade HF35 -3
Configuration Method Passive Serial, Fast Passive Parallel, Active Serial, JTAG —
RoHS 状态 Compliant Compliant
MSL 等级 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Logic Elements (LE) — 72,600
Embedded Memory Bits — 7,564,880 (about 7.5 Mbit)
Embedded Memory Blocks — 72600
Number of Logic Cells / Arrays — 372
Number of User I/O Pins — 372
Number of Transceiver Channels — [DATA_NEEDED: exact channel count for this device]
Transceiver Data Rate — [DATA_NEEDED: per-channel data rate]
Package Type — 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip)
Package Code — DF29
Operating Temperature Grade — Industrial (I3)
Junction Temperature Range — -40C to +100C
无卤 — [DATA_NEEDED: halogen-free claim]

数据手册与资源

浏览全部产品 创建 BOM 获取报价