EPF10K100EBC356-2 vs EPF10K100EBC356-3 Vergleich

Detaillierter Direktvergleich von EPF10K100EBC356-2 von Intel und EPF10K100EBC356-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100EBC356-2 EPF10K100EBC356-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $59,95 $62,50
Series FLEX-10KE —
Family Embedded Programmable Logic Device (PLD) FLEX-10KE
Typical Gates 100,000 —
Maximum System Gates 158,000 —
Logic Elements (LEs) 4,992 —
Number of LABs/CLBs 624 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 49,152 —
User I/O Pins 274 —
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) 2.5 V (2.375 V to 2.625 V)
Propagation Delay (tPD) 0.5 ns —
Internal Operating Frequency up to 250 MHz —
Process Technology CMOS, SRAM-based 0.22 micron CMOS
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) —
Betriebstemperatur 0 C to 70 C (Commercial) 0 C to 70 C (Commercial)
Montageart Surface Mount Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) —
Speed Grade -2 -3
RoHS-Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements / Cells — 4,992
Total Gates — ~100,000
Logic Array Blocks (LABs) — 624
Embedded Memory (RAM bits) — 49,152
User I/Os — 274
Propagation Delay (typical) — 0.6 ns
Maximum Internal Frequency — 200 MHz
Configuration Technology — SRAM (volatile)
Gehäuse — 356-LBGA (35 x 35 mm)

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