EPF10K100EBC356-2 vs EPF10K100EBC356-3 Comparação
Comparação detalhada lado a lado de EPF10K100EBC356-2 por Intel e EPF10K100EBC356-3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteComparação de especificações
| Parâmetro | EPF10K100EBC356-2 | EPF10K100EBC356-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $59,95 | $62,50 |
| Series | FLEX-10KE | — |
| Family | Embedded Programmable Logic Device (PLD) | FLEX-10KE |
| Typical Gates | 100,000 | — |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | 2.5 V (2.375 V to 2.625 V) |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | 0.22 micron CMOS |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | — |
| Temperatura de operação | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Speed Grade | -2 | -3 |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 4,992 |
| Total Gates | — | ~100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Memory (RAM bits) | — | 49,152 |
| User I/Os | — | 274 |
| Propagation Delay (typical) | — | 0.6 ns |
| Maximum Internal Frequency | — | 200 MHz |
| Configuration Technology | — | SRAM (volatile) |
| Encapsulamento | — | 356-LBGA (35 x 35 mm) |