EPF10K200EBI600-2N vs EPF10K200EBC600-2 Vergleich
Detaillierter Direktvergleich von EPF10K200EBI600-2N von Intel und EPF10K200EBC600-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200EBI600-2N | EPF10K200EBC600-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $140,00 | $198,00 |
| Family | FLEX 10KE | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | 9984 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Dedicated Inputs | 6 | — |
| Gehäuse | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | — |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns |
| Maximum Internal Frequency | 200 MHz | — |
| Betriebstemperatur | 0 °C to +70 °C (commercial) | 0°C to +70°C (Commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | JTAG (IEEE 1149.1), EPC2 serial PROM |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | unknown |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Versorgungsspannung | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Part Status | — | Obsolete |