EPF10K200EBI600-2N vs EPF10K200EBC600-2 对比

详细并排对比 EPF10K200EBI600-2N 出自 Intel 和 EPF10K200EBC600-2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

规格对比

参数 EPF10K200EBI600-2N EPF10K200EBC600-2
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $140.00 $198.00
Family FLEX 10KE —
Typical Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 9984
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 98,304 —
User I/O Pins 470 —
Dedicated Inputs 6 —
封装 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) —
Technology / Process 0.22 µm CMOS SRAM —
Core Supply Voltage 2.5 V (2.3 V to 2.7 V) —
I/O Supply Voltage 2.5 V / 3.3 V (5 V tolerant I/O available) —
Propagation Delay 0.4 ns to 0.6 ns (per LE) 0.4 ns
Maximum Internal Frequency 200 MHz —
工作温度 0 °C to +70 °C (commercial) 0°C to +70°C (Commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1), serial configuration EPROM JTAG (IEEE 1149.1), EPC2 serial PROM
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] unknown
安装类型 Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Process Technology — 0.30 µm CMOS
Typical Gate Count — 200,000 gates
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
电源电压 — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Part Status — Obsolete

数据手册与资源

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