EPF10K200EBI600-2N vs EPF10K200EBC600-2 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBI600-2N par Intel et EPF10K200EBC600-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K200EBI600-2N | EPF10K200EBC600-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $140,00 | $198,00 |
| Family | FLEX 10KE | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | 9984 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Dedicated Inputs | 6 | — |
| Boîtier | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | — |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns |
| Maximum Internal Frequency | 200 MHz | — |
| Température de fonctionnement | 0 °C to +70 °C (commercial) | 0°C to +70°C (Commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Tension d'alimentation | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Part Status | — | Obsolete |