EPF10K200EBI600-2N vs EPF10K200EBC600-2 비교

다음의 상세 나란히 비교: EPF10K200EBI600-2N 제조: Intel 및 EPF10K200EBC600-2 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

사양 비교

파라미터 EPF10K200EBI600-2N EPF10K200EBC600-2
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Obsolete Obsolete
재고 상태 In Stock In Stock
단가 (USD) $140.00 $198.00
Family FLEX 10KE —
Typical Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 9984
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 98,304 —
User I/O Pins 470 —
Dedicated Inputs 6 —
패키지 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) —
Technology / Process 0.22 µm CMOS SRAM —
Core Supply Voltage 2.5 V (2.3 V to 2.7 V) —
I/O Supply Voltage 2.5 V / 3.3 V (5 V tolerant I/O available) —
Propagation Delay 0.4 ns to 0.6 ns (per LE) 0.4 ns
Maximum Internal Frequency 200 MHz —
동작 온도 0 °C to +70 °C (commercial) 0°C to +70°C (Commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1), serial configuration EPROM JTAG (IEEE 1149.1), EPC2 serial PROM
MSL 레벨 [DATA_NEEDED: moisture sensitivity level] —
RoHS 상태 [DATA_NEEDED: RoHS compliance status] unknown
실장 유형 Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Process Technology — 0.30 µm CMOS
Typical Gate Count — 200,000 gates
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
공급 전압 — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Part Status — Obsolete

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