EPM2210GF324C5N - 2210 LE MAX II CPLD, 212 I/O, BGA-324 | Intel
Teilenummer: EPM2210GF324C5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.9 | $17.900,00 |
EPM2210GF324C5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architectural simplicity of PAL/GAL with the density and routing capacity of an FPGA, while retaining instant-on operation through on-chip flash configuration memory. CPLDs sit in the programmable-logic hierarchy below FPGAs and above discrete logic ICs (74-series gates), making them ideal for glue logic, bus bridging, I/O expansion, and power-up deterministic state machines in mixed-voltage systems.
Key features of the EPM2210GF324C5N include a tPD (pin-to-pin propagation delay) of 11.2 ns, MultiVolt core I/O support allowing interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, an internal 3.3 V or 2.5 V core voltage option, JTAG-based IEEE 1532 in-system programmability, and enhanced ISP with Quartus II design software support. The device operates across the commercial 0 °C to +85 °C range and uses low-power 6-layer metal flash CMOS process technology.
Architecturally, the MAX II G family uses a Logic Array Block (LAB) structure with 32 LEs per LAB and a MultiTrack interconnect, allowing deterministic timing and fast pin-to-pin performance that contrasts with the configuration-dependent timing of SRAM-based FPGAs. The integrated UFM block can replace external EEPROMs in applications such as boot configuration storage, serial number retention, and design revision tracking.
Typical applications include I/O expansion and bus bridging in industrial control systems, glue logic between microprocessors and peripherals in telecom line cards, power-up sequencing logic in networking switches and routers, and LED display driving in digital signage. The MAX II G family is pin-compatible with the MAX IIG family, simplifying design portability.
When designing with this device, ensure proper decoupling (0.1 µF and 10 µF capacitors) near each VCC pin and observe JTAG chain integrity during ISP. The MultiVolt I/O feature eliminates external level shifters when bridging 3.3 V logic to 5 V peripherals.
This page synthesizes distributor pricing, drop-in MAX II G family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EPM2210GF324C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM2210GF324C5N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, RoHS Status, Operating Temperature, Programming Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM2210GF324C4N
✅ Drop-In✓ Auf Lager
$25.6 / Stück
Datenblatt ansehen →EPM2210GF324C5
✅ Drop-In✓ Auf Lager
$13.6 / Stück
Datenblatt ansehen →EPM2210GF324I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$42 / Stück
Datenblatt ansehen →EPM2210F324I8N
✅ Drop-In✓ Auf Lager
$21.8 / Stück
Datenblatt ansehen →EPM2210GF324C5N Grenzwerte & elektrische Eigenschaften
| Family | MAX II G |
| Series | MAX II |
| Logic Elements | 2210 |
| Equivalent Macrocells | 1700 |
| User Flash Memory (UFM) | 8 Kbits |
| Maximum User I/O | 212 |
| Pin-to-Pin Delay (tPD) | 11.2 ns |
| Propagation Delay | 11.2 ns (max) |
| Technology | Flash CMOS, 6-layer metal |
| Core Voltage | 3.3 V / 2.5 V (internal) |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Gehäuse | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Montageart | Surface Mount |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | Yes |
| RoHS-Status | Compliant |
| MSL-Level | 3 |
EPM2210GF324C5N Pin-Konfiguration
| Pin A1 | I/O — General purpose user I/O pin |
| Pin B2 | I/O — General purpose user I/O pin |
| Pin C3 | GND — Ground reference |
| Pin D4 | I/O — General purpose user I/O pin |
| Pin F2 | VCCIO — I/O supply voltage (1.5 V to 5.0 V) |
| Pin G1 | VCCINT — Internal core voltage (3.3 V or 2.5 V) |
| Pin H3 | TCK — JTAG Test Clock |
| Pin J4 | TDO — JTAG Test Data Out |
| Pin K1 | TMS — JTAG Test Mode Select |
| Pin L2 | TDI — JTAG Test Data In |
Typische Anwendungen
EPM2210GF324C5N ist geeignet für 6 Anwendungs: Industrial I/O Expansion and Bus Bridging, Telecom Line Card Glue Logic, Networking Switch / Router Power-Up Sequencing, LED Display Driver and Signage, Automotive Infotainment Auxiliary Logic, Medical Device Interface and Monitoring.
Industrial I/O Expansion and Bus Bridging
The EPM2210GF324C5N's 212 user I/O and MultiVolt core (1.5 V to 5.0 V interfacing) make it ideal for I/O expansion and bus bridging in industrial control systems. Its 2,210 logic elements comfortably implement address decoding, chip-select generation, and protocol conversion between 3.3 V processors and 5 V peripherals, while the 11.2 ns pin-to-pin delay supports glue logic operating at typical MCU bus speeds without adding latency. The non-volatile flash configuration eliminates external boot memory, reducing BOM cost and board area in PLC and industrial I/O module designs.
Empfohlen
Telecom Line Card Glue Logic
In telecom line cards, the EPM2210GF324C5N provides deterministic, instant-on glue logic between network processors, PHYs, and backplane SERDES devices. The integrated 8 Kbit UFM can store board-level configuration, revision IDs, and cryptographic keys, replacing an external EEPROM. With 11.2 ns tPD and MultiVolt I/O, the device bridges 1.8 V processors to 3.3 V legacy peripherals while meeting telecom card timing margins. JTAG-based in-system programmability simplifies board-level rework and field upgrades on live cards.
Empfohlen
Networking Switch / Router Power-Up Sequencing
The EPM2210GF324C5N is well-suited for power-up and power-down sequencing logic in networking switches and routers. Its non-volatile, instant-on configuration guarantees deterministic sequencing state at every power cycle, while 2,210 logic elements provide more than enough capacity for sequencing multiple DC-DC rails and reset signals. The 212 user I/O pins support sequencing controllers and supervisor ICs across an entire chassis. MultiVolt I/O interfaces with mixed-voltage power management devices without external level shifters.
Empfohlen
LED Display Driver and Signage
The EPM2210GF324C5N drives large LED display panels by generating row-scan timing, brightness modulation (PWM), and data multiplexing signals. Its 11.2 ns pin-to-pin delay supports high refresh rates required for video-rate LED walls, and the 212 I/O pins can drive multiple parallel data channels simultaneously. Non-volatile storage means display configurations survive power cycles with no boot delay. MultiVolt I/O interfaces with both 3.3 V FPGA video sources and 5 V LED driver chains on the same board.
Empfohlen
Automotive Infotainment Auxiliary Logic
Although the EPM2210GF324C5N is commercial grade, it serves well in non-safety automotive infotainment subsystems where cost matters more than AEC-Q100 qualification. The device implements auxiliary logic for media decoders, USB hub resets, and backlight controllers. Its 8 Kbit UFM stores infotainment configuration such as CAN node IDs and feature flags. The 11.2 ns delay supports audio sample-rate clock gating with negligible jitter contribution.
Empfohlen
Medical Device Interface and Monitoring
In non-critical medical monitoring equipment such as bedside displays and patient interface modules, the EPM2210GF324C5N provides deterministic glue logic between sensor front-ends, ADCs, and the main processor. Its MultiVolt I/O bridges 5 V analog front-end signals to 1.8 V SoC rails, eliminating external level shifters. The instant-on non-volatile configuration is valuable in safety-conscious designs where predictable boot behavior matters. The 8 Kbit UFM stores calibration coefficients and device serial numbers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM2210GF324C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM2210GF324C4N | EPM2210GF324C5 | EPM2210F324I8N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-324 (19x19 mm) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) |
| Logic Elements | 2210 | 2210 | 2210 | 2210 |
| Pin-to-Pin Delay (tPD) | 11.2 ns | Slower (C4 grade) | 11.2 ns | I8 industrial grade |
| User I/O | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C |
| RoHS Compliant | Yes (N suffix) | Yes (N suffix) | No (no N suffix) | Yes (N suffix) |
| Speed Grade | C5 (fastest) | C4 | C5 | I8 |
Wichtigste Unterscheidungsmerkmale
- Highest-density non-volatile CPLD in MAX II G family (vs. EPM2210GF256C5N)
- RoHS-compliant lead-free terminal finish (N suffix) (vs. EPM2210GF324C5)
- Fastest C5 speed grade for timing-critical glue logic (vs. EPM2210GF324C4N)
Designhinweise
Decouple each VCCINT and VCCIO pin with a 0.1 µF ceramic capacitor placed within 100 mil of the pin, plus a single 10 µF bulk capacitor per supply rail on the board. Estimated: a 2,210-LE MAX II G device typically draws 30 to 80 mA active depending on toggle rate; size the 3.3 V regulator at 200 mA for design margin.
The FBGA-324 package uses 1.0 mm pitch BGA balls and requires 4 to 6 layer PCB with microvia or via-in-pad for fanout. Use a 19 x 19 mm land pattern with non-solder-mask-defined (NSMD) pads of 0.5 mm diameter for reliable assembly per IPC-7351. Maintain 0.2 mm trace-to-pad clearance on inner layers.
JTAG chain integrity is critical for in-system programming. Keep TCK, TMS, TDI, TDO traces short and length-matched within 25 mm. Add a 10 kΩ pull-up on TCK and TMS, and a 10 kΩ pull-up on TDI to ensure defined logic levels when the CPLD is not driving the chain. Terminate TDO with a 33 Ω series resistor if driving a long backplane.
Do not confuse EPM2210GF324C5N (FBGA-324, commercial) with EPM2210GF256C5N (FBGA-256, smaller package) - the pinouts differ and the devices are not drop-in. Also, MAX II G voltage requirements differ from legacy MAX 7000; verify VCCINT (3.3 V vs 2.5 V) and VCCIO selection via the Quartus device configuration before layout.
Compliance-Informationen
RoHS-compliant per Intel/Altera product page (N suffix denotes lead-free terminal finish). Commercial temperature grade only; not AEC-Q100 qualified - choose EPM2210GF324I5N or EPM2210F324I8N for industrial temperature applications.
