EPM570F256C4N vs EPM570GF256C4 Vergleich
Detaillierter Direktvergleich von EPM570F256C4N von Intel und EPM570GF256C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C4N | EPM570GF256C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $26,85 | $29,85 |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Gehäuse | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm CMOS, flash-based configuration |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Betriebstemperaturbereich | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Lead-free, RoHS compliant |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Maximum User I/Os | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Betriebstemperatur | — | 0 °C to +85 °C (commercial) |
| Ball Pitch | — | 1.0 mm |
| JTAG Support | — | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |