EPM570F256C4N vs EPM570GF256C4 对比
详细并排对比 EPM570F256C4N 出自 Intel 和 EPM570GF256C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570F256C4N | EPM570GF256C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $26.85 | $29.85 |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| 封装 | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm CMOS, flash-based configuration |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 工作温度范围 | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Lead-free, RoHS compliant |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Maximum User I/Os | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| 工作温度 | — | 0 °C to +85 °C (commercial) |
| Ball Pitch | — | 1.0 mm |
| JTAG Support | — | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |