EPM570F256C4N vs EPM570GF256C4 Comparison
Detailed side-by-side comparison of EPM570F256C4N by Intel and EPM570GF256C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM570F256C4N | EPM570GF256C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $26.85 | $29.85 |
| Series | MAX II | β |
| Logic Elements | 570 LE | β |
| Macrocells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | β |
| User I/O Count | 160 | β |
| User Flash Memory (UFM) | 8 Kbit | β |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm Γ 17 mm | β |
| Process Technology | 0.18 Β΅m 6-layer-metal flash | 0.18 Β΅m CMOS, flash-based configuration |
| Maximum Internal Frequency | 304 MHz | β |
| Pin-to-Pin Logic Delay | 5.4 ns | β |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | β |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | β |
| Operating Temperature Range | 0 Β°C to +70 Β°C (commercial) | β |
| In-System Programmability (ISP) | Yes (JTAG) | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Lead-free, RoHS compliant |
| Family | β | MAX II |
| Logic Elements (LEs) | β | 570 |
| Maximum User I/Os | β | 212 |
| Pin-to-Pin Delay (tPD) | β | 5.4 ns |
| Supply Voltage VCCINT | β | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Operating Temperature | β | 0 Β°C to +85 Β°C (commercial) |
| Ball Pitch | β | 1.0 mm |
| JTAG Support | β | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | β | Non-volatile flash (instant-on, no boot PROM) |