EPM570F256C4N vs EPM570GF256C4 Comparación
Comparación detallada lado a lado de EPM570F256C4N por Intel y EPM570GF256C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570F256C4N | EPM570GF256C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $26,85 | $29,85 |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm CMOS, flash-based configuration |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Rango de temperatura de funcionamiento | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Lead-free, RoHS compliant |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Maximum User I/Os | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (commercial) |
| Ball Pitch | — | 1.0 mm |
| JTAG Support | — | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |