H5ANAG4NBJR-UHC vs H5ANAG6NBJR-UHC Vergleich
Detaillierter Direktvergleich von H5ANAG4NBJR-UHC von SK hynix und H5ANAG6NBJR-UHC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5ANAG4NBJR-UHC | H5ANAG6NBJR-UHC |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | DRAM | DRAM |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,09 | $8,09 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gb |
| Speicherorganisation | 256M x16 | 256M x 16 |
| Supply Voltage (VDD) | 1.14 V to 1.26 V (nominal 1.2 V) | — |
| Clock / Data Rate | 1.6 GHz | — |
| Gehäuse | FBGA-96 (PBGA96) | PBGA96 / FBGA-96 (TFBGA) |
| Betriebstemperatur | -40C to +95C | -40C to +95C |
| Schnittstelle | CMOS, DDR4 (double data rate) | DDR4 (CMOS) |
| Data Mask (DM) | Yes | — |
| Asynchronous Reset | Yes | Supported |
| On-Die Termination (ODT) | Dynamic ODT | — |
| ZQ Calibration | Yes | Supported |
| Write Leveling | Yes | Supported |
| CRC Function | Yes | — |
| Auto Self-Refresh | Yes | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | RoHS Compliant |
| CAS-Latenz | [DATA_NEEDED: CAS Latency / speed bin detail] | [DATA_NEEDED: CAS Latency] |
| Package Dimensions | — | 13 mm length (per JESD-30 R-PBGA-B96) |
| Access Mode | — | Multi Bank, Page Burst |
| Refresh | — | Auto / Self Refresh |
| Data Mask | — | Supported (DM function) |
| On-Chip Termination | — | Dynamic ODT |
| CRC | — | Supported |
| Supply Voltage Class | — | DDR4 (1.2 V class) |
| REACH Compliance | — | Compliant |
| ECCN | — | EAR99 |
| HTS Code | — | 8542.32.00.36 |
| Max Data Rate | — | [DATA_NEEDED: Max Data Rate] |