H5ANAG4NBJR-UHC vs H5ANAG6NBJR-UHC 对比
详细并排对比 H5ANAG4NBJR-UHC 出自 SK hynix 和 H5ANAG6NBJR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5ANAG4NBJR-UHC | H5ANAG6NBJR-UHC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | DRAM | DRAM |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $8.09 | $8.09 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gb |
| 存储组织 | 256M x16 | 256M x 16 |
| Supply Voltage (VDD) | 1.14 V to 1.26 V (nominal 1.2 V) | — |
| Clock / Data Rate | 1.6 GHz | — |
| 封装 | FBGA-96 (PBGA96) | PBGA96 / FBGA-96 (TFBGA) |
| 工作温度 | -40C to +95C | -40C to +95C |
| 接口 | CMOS, DDR4 (double data rate) | DDR4 (CMOS) |
| Data Mask (DM) | Yes | — |
| Asynchronous Reset | Yes | Supported |
| On-Die Termination (ODT) | Dynamic ODT | — |
| ZQ Calibration | Yes | Supported |
| Write Leveling | Yes | Supported |
| CRC Function | Yes | — |
| Auto Self-Refresh | Yes | — |
| 安装类型 | Surface Mount (BGA) | — |
| RoHS 状态 | Compliant | RoHS Compliant |
| CAS 延迟 | [DATA_NEEDED: CAS Latency / speed bin detail] | [DATA_NEEDED: CAS Latency] |
| Package Dimensions | — | 13 mm length (per JESD-30 R-PBGA-B96) |
| Access Mode | — | Multi Bank, Page Burst |
| Refresh | — | Auto / Self Refresh |
| Data Mask | — | Supported (DM function) |
| On-Chip Termination | — | Dynamic ODT |
| CRC | — | Supported |
| Supply Voltage Class | — | DDR4 (1.2 V class) |
| REACH Compliance | — | Compliant |
| ECCN | — | EAR99 |
| HTS Code | — | 8542.32.00.36 |
| Max Data Rate | — | [DATA_NEEDED: Max Data Rate] |