K9EUGY8S0M-BCK0 vs K9IUGY8J7B-CCK0 Vergleich

Detaillierter Direktvergleich von K9EUGY8S0M-BCK0 von Samsung Electro-Mechanics und K9IUGY8J7B-CCK0 von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Samsung Electro-Mechanics
K9EUGY8S0M-BCK0 K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 ✓ Aktiv
Samsung Electronics
K9IUGY8J7B-CCK0 K9IUGY8J7B-CCK0 - 1Tb 3D V-NAND TLC Flash | Samsung

K9IUGY8J7B-CCK0 - 1Tb 3D V-NAND TLC Flash | Samsung

K9IUGY8J7B-CCK0 ✓ Aktiv

Spezifikationsvergleich

Parameter K9EUGY8S0M-BCK0 K9IUGY8J7B-CCK0
Marke Samsung Electro-Mechanics Samsung Electronics
Kategorie Memory ICs EEPROM
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1,00
Manufacturer Samsung Electronics Samsung Electronics
Product Family K9-series V-NAND Flash —
Speichertyp NAND Flash (non-volatile) NAND Flash, 3D V-NAND TLC
Density [DATA_NEEDED: memory density] —
Speicherorganisation [DATA_NEEDED: organization x8/x16] —
Cell Type [DATA_NEEDED: SLC/MLC/TLC/QLC] TLC (3 bits per cell)
Versorgungsspannung [DATA_NEEDED: VCC voltage] —
VCCQ Voltage [DATA_NEEDED: VCCQ voltage] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: block size]
Access Time (tR) [DATA_NEEDED: read access time] —
Program Time (tPROG) [DATA_NEEDED: program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Gehäuse [DATA_NEEDED: package type and dimensions] —
Betriebstemperatur [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Packing [DATA_NEEDED: tray or tape and reel] —
Memory Density — 1 Tb (Tera bit)
V-NAND Generation — V6 (6th generation)
Process Node / Layer Count — 4448-128L (128-layer)
Schnittstellentyp — [DATA_NEEDED: bus interface type]
Supply Voltage (VCC) — [DATA_NEEDED: VCC voltage]
Supply Voltage (VCCQ) — [DATA_NEEDED: VCCQ voltage]
Datenbusbreite — [DATA_NEEDED: data bus width]
Program/Erase Cycles — [DATA_NEEDED: P/E cycle endurance]
Package Type — [DATA_NEEDED: exact package code]

Datenblätter & Ressourcen

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