MC9S08AW48CPUE vs MC9S08AW32CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW48CPUE von NXP Semiconductors und MC9S08AW32CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW48CPUE | MC9S08AW32CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $6,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Type | FLASH | — |
| Program Memory Size | 48 KB (48K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Packaging | Tray | Tray |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Max Clock Speed | — | 40 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| ADC Resolution | — | 10-bit |
| Gehäuse | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Family | — | S08AW (AW60/48/32/16) |