MC9S08AW48CPUE vs MC9S08AW32CPUE Comparación
Comparación detallada lado a lado de MC9S08AW48CPUE por NXP Semiconductors y MC9S08AW32CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW48CPUE | MC9S08AW32CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $6,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Type | FLASH | — |
| Program Memory Size | 48 KB (48K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Packaging | Tray | Tray |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Max Clock Speed | — | 40 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| ADC Resolution | — | 10-bit |
| Encapsulado | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Family | — | S08AW (AW60/48/32/16) |