MC9S08AW48CPUE vs MC9S08AW32CPUE 비교

다음의 상세 나란히 비교: MC9S08AW48CPUE 제조: NXP Semiconductors 및 MC9S08AW32CPUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd
NXP Semiconductors
MC9S08AW32CPUE MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE Nrnd

사양 비교

파라미터 MC9S08AW48CPUE MC9S08AW32CPUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $0.00 $6.10
Core Processor S08 (HCS08) 8-bit CISC S08
Core Size 8-bit 8-Bit
CPU Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory Type FLASH —
Program Memory Size 48 KB (48K x 8) —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Count 38 38
Package Type 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) —
Package Height 1 mm —
실장 유형 Surface Mount Surface Mount
동작 온도 [DATA_NEEDED: operating temperature range] -40C to +85C
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Instruction Set HC08 with added BGND instruction HC08 with added BGND instruction
Packaging Tray Tray
수명 주기 상태 NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
RoHS 상태 [DATA_NEEDED: RoHS status] —
Max Clock Speed — 40 MHz
Flash Memory — 32KB (32K x 8)
RAM — 2KB
ADC Resolution — 10-bit
패키지 — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Family — S08AW (AW60/48/32/16)

데이터시트 & 자료

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