MC9S08AW48CPUE vs MC9S08AW32CPUE 对比

详细并排对比 MC9S08AW48CPUE 出自 NXP Semiconductors 和 MC9S08AW32CPUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd
NXP Semiconductors
MC9S08AW32CPUE MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE Nrnd

规格对比

参数 MC9S08AW48CPUE MC9S08AW32CPUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $0.00 $6.10
Core Processor S08 (HCS08) 8-bit CISC S08
Core Size 8-bit 8-Bit
CPU Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory Type FLASH —
Program Memory Size 48 KB (48K x 8) —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Count 38 38
Package Type 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) —
Package Height 1 mm —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] -40C to +85C
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Instruction Set HC08 with added BGND instruction HC08 with added BGND instruction
Packaging Tray Tray
生命周期状态 NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
RoHS 状态 [DATA_NEEDED: RoHS status] —
Max Clock Speed — 40 MHz
Flash Memory — 32KB (32K x 8)
RAM — 2KB
ADC Resolution — 10-bit
封装 — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
Family — S08AW (AW60/48/32/16)

数据手册与资源

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